CTU FEE Moodle
Technology in Electrical Engineering
This is a grouped Moodle course. It consists of several separate courses that share learning materials, assignments, tests etc. Below you can see information about the individual courses that make up this Moodle course.
Technology in Electrical Engineering (Main course) A1B13VST
| Credits | 6 |
| Semesters | Summer |
| Completion | Assessment + Examination |
| Language of teaching | Czech |
| Extent of teaching | 2+2L |
Annotation
Production systems in electrical engineering will be characterized, their arrangement and basic technologies for mechanical joints and plastic parts. Manufacturing of windings,drying and impregnation processes will also been presented. Next part of a course will be focused on basic technologies for semiconductors including power integration. Beam technologies, technologies using plasma, packaging and basic assembly technologies will also been presented.
Study targets
Students learn basic types of technological processes used in electrical production as well as with basic types of power electronic components and their properties.
Course outlines
1. Lasers and laser beam as a technological tool.
2. Electron gun and electron beam as a technological tool. Plasma and plasma technologies.
3. Induction heating. Dielectric heating
4. Processes in the fields of electric power. Fast (rapid) prototyping.
5. Basic semiconductor structures. Characteristics, technological possibilities, realizations.
6. Power PIN and Schottky diodes. Static and dynamic parameters. Static and dynamic characteristics. Applications.
7. Current controlled devices. Thyristors (SCR), GTO, GTC, IGCT. Applications.
8. Voltage controlled devices (VDMOS, TMOS). IGBT, Structure and parameters. Applications.
9. Power integration. Power modules, principles, construction, technology. IPM. Cooling. Applications.
10. Winding of electrical machines - types, technology, drying, applications
11. Magnetic circuits of electrical machines - types, technology
12. Technology of surface finishes and protective layers.
13. Production systems in electrical engineering, types, arrangement.
2. Electron gun and electron beam as a technological tool. Plasma and plasma technologies.
3. Induction heating. Dielectric heating
4. Processes in the fields of electric power. Fast (rapid) prototyping.
5. Basic semiconductor structures. Characteristics, technological possibilities, realizations.
6. Power PIN and Schottky diodes. Static and dynamic parameters. Static and dynamic characteristics. Applications.
7. Current controlled devices. Thyristors (SCR), GTO, GTC, IGCT. Applications.
8. Voltage controlled devices (VDMOS, TMOS). IGBT, Structure and parameters. Applications.
9. Power integration. Power modules, principles, construction, technology. IPM. Cooling. Applications.
10. Winding of electrical machines - types, technology, drying, applications
11. Magnetic circuits of electrical machines - types, technology
12. Technology of surface finishes and protective layers.
13. Production systems in electrical engineering, types, arrangement.
Exercises outlines
1. Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 to 2
2. Explanation and demonstration of tasks 3 to 6
3. Vacuum drying and impregnation.
4. Soft soldering in electrical engineering.
5. Joining of power cables.
6. Joining of conductors and cables. Test.
7. Drilling and checking of PC boards.
8. Sputtering and evaporation of thin films.
9. Explanation and demonstration of tasks 7 to 9.
10. Task 7
11. Task 8
12. Task 9
13. Checking of laboratory results.
14. Assessment.
2. Explanation and demonstration of tasks 3 to 6
3. Vacuum drying and impregnation.
4. Soft soldering in electrical engineering.
5. Joining of power cables.
6. Joining of conductors and cables. Test.
7. Drilling and checking of PC boards.
8. Sputtering and evaporation of thin films.
9. Explanation and demonstration of tasks 7 to 9.
10. Task 7
11. Task 8
12. Task 9
13. Checking of laboratory results.
14. Assessment.
Literature
1.Benda, V. et al: Power Semiconductor Devices - Theory and Applications, J. Wiley, 1999
2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003
3. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007
4. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012
2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003
3. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007
4. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012
Requirements
A student must attend at a practical training and must obtain an assessment before examination. A knowledge of lectured matter and laboratory tasks will be required at examination.
Power components and technology AD1B13VST
| Credits | 6 |
| Semesters | Summer |
| Completion | Assessment + Examination |
| Language of teaching | Czech |
| Extent of teaching | 14KP+6KL |
Annotation
Production systems in electrical engineering will be characterized, their arrangement and basic technologies for mechanical joints and plastic parts. Manufacturing of windings,drying and impregnation processes will also been presented. Next part of a course will be focused on basic technologies for semiconductors including power integration. Beam technologies, technologies using plasma, packaging and basic assembly technologies will also been presented.
Study targets
Students learn basic types of technological processes used in electrical production as well as with basic types of power electronic components and their properties.
Course outlines
1. Lasers and laser beam as a technological tool.
2. Electron gun and electron beam as a technological tool. Plasma and plasma technologies.
3. Induction heating. Dielectric heating
4. Processes in the fields of electric power. Fast (rapid) prototyping.
5. Basic semiconductor structures. Characteristics, technological possibilities, realizations.
6. Power PIN and Schottky diodes. Static and dynamic parameters. Static and dynamic characteristics. Applications.
7. Current controlled devices. Thyristors (SCR), GTO, GTC, IGCT. Applications.
8. Voltage controlled devices (VDMOS, TMOS). IGBT, Structure and parameters. Applications.
9. Power integration. Power modules, principles, construction, technology. IPM. Cooling. Applications.
10. Winding of electrical machines - types, technology, drying, applications
11. Magnetic circuits of electrical machines - types, technology
12. Technology of surface finishes and protective layers.
13. Production systems in electrical engineering, types, arrangement.
2. Electron gun and electron beam as a technological tool. Plasma and plasma technologies.
3. Induction heating. Dielectric heating
4. Processes in the fields of electric power. Fast (rapid) prototyping.
5. Basic semiconductor structures. Characteristics, technological possibilities, realizations.
6. Power PIN and Schottky diodes. Static and dynamic parameters. Static and dynamic characteristics. Applications.
7. Current controlled devices. Thyristors (SCR), GTO, GTC, IGCT. Applications.
8. Voltage controlled devices (VDMOS, TMOS). IGBT, Structure and parameters. Applications.
9. Power integration. Power modules, principles, construction, technology. IPM. Cooling. Applications.
10. Winding of electrical machines - types, technology, drying, applications
11. Magnetic circuits of electrical machines - types, technology
12. Technology of surface finishes and protective layers.
13. Production systems in electrical engineering, types, arrangement.
Exercises outlines
1. Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 to 2
2. Explanation and demonstration of tasks 3 to 6
3. Vacuum drying and impregnation.
4. Soft soldering in electrical engineering.
5. Joining of power cables.
6. Joining of conductors and cables. Test.
7. Drilling and checking of PC boards.
8. Sputtering and evaporation of thin films.
9. Explanation and demonstration of tasks 7 to 9.
10. Task 7
11. Task 8
12. Task 9
13. Checking of laboratory results.
14. Assessment.
2. Explanation and demonstration of tasks 3 to 6
3. Vacuum drying and impregnation.
4. Soft soldering in electrical engineering.
5. Joining of power cables.
6. Joining of conductors and cables. Test.
7. Drilling and checking of PC boards.
8. Sputtering and evaporation of thin films.
9. Explanation and demonstration of tasks 7 to 9.
10. Task 7
11. Task 8
12. Task 9
13. Checking of laboratory results.
14. Assessment.
Literature
1.Benda, V. et al: Power Semiconductor Devices - Theory and Applications, J. Wiley, 1999
2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003
3. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007
4. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012
2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003
3. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007
4. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012
Requirements
A student must attend at a practical training and must obtain an assessment before examination. A knowledge of lectured matter and laboratory tasks will be required at examination.
Responsible for the data validity:
Study Information System (KOS)